Custom Wafer Packaging Solutions

We design custom wafer packaging to meet your unique needs. Whether flip-chip or wafer-level packaging, our tailored services ensure top performance. By collaborating closely with clients, we deliver high-quality, customized solutions. Get the perfect packaging for your products now.

Precision Flip Chip Services

Our automatic transfer molders offer superior automation and precision for semiconductor packaging. With our state-of-the-art technology, you can achieve higher productivity and quality in your manufacturing processes. We design our molders to meet the stringent demands of the industry. Our solutions not only enhance efficiency but also ensure the highest standards of performance. Experience the difference with our innovative technology.

High-Precision Placement Machines

We design our placement machines to ensure high-precision and efficient component placement. They ensure accurate alignment and reliable performance, making them ideal for complex semiconductor assemblies. We are committed to providing machines that meet the highest standards of precision. Our technology ensures unparalleled precision in the placement of your components, resulting in improved overall product quality. Achieve precision in every placement with our advanced machines.

Superior Laser Drilling Machines

 Automated Machinery Development

We specialize in developing customized automated machinery tailored to your specific needs. Our solutions are designed to improve efficiency, reduce costs, and enhance the overall performance of your manufacturing processes. With a focus on innovation, we deliver machinery that aligns with your operational goals. Our team works closely with you to ensure each solution is perfectly suited to your requirements.